2007 SSE Maximus 804

Configuration:

Wafersize: currently set up for 8"

Coater: Open Bowl, 1 Dispense Arm

Backside Rinse (BSR) , Edge Bead Removal (EBR), 3 Dispense

Developer

Wafersize: currently set up for 8"

1 Dispense Arm with 2 Developer Lines, 1 DI Water Line, 1 N2 purge line, Backside Rinse (BSR)

Hotplates 3 units 

Temperature up to 250 Degree Celsius

Lifting Pins stepper motor driven

HMDS Hotplate 1 Unit

Coolplates 3 Units

Lifting Pins stepper motor driven

Isel Roboter

2 Cassettes