Description Delaminator Wafer Size Range Minimum 150 mm Maximum 300 mm Set Size 300 mm C...

Description Grinder Wafer Size Range Minimum 150 mm Maximum 200 mm Set Size 200 mm Casse...

High speed, large area ball bonder Thermosonic ball-and-stich wire bonder 12"x6" (300mm x 150mm...

Nitto M286N 2005.10 W524A05

Magazine and stack loader input Magazine output 8 Inch wafer table and expansion unit Dispensi...

Working condition , A demo video can be provided on receipt of PO. Automatic dicing saw, up to 8...

Sold in Good working condition With NCS and BBD 2.2 Kw Spindle

Sold in working condition Does not include NCS or BBD

We have a subcontractor in Manila , Philippines, who can Assemble your devices in Metal Can devic...

One DAD3350 vintage 2005 still in production for sale with working condition, NCS, BBD, 1.8KW, 2...