ESEC 3100 Ball-WIRE Bonder

ESEC 3100 Ball-WIRE Bonder

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Description

Specifications Ultrasonic frequency: 130 kHz Flying bondhead Fixed electrode (EFO currents upto 400 mA) Bond placement accuracy: ± 2.5 µm (3 sigma) Sprint UPH: 17 wires/second (UPH depends on material/ process requirements) Maximum bonding area: 52 mm x 70 mm (2" x 2.7") Process zone temperature: ambient to 300°C Various looping profiles, maximum loop length of 9 mm Application Gold and copper wire (17.5 µm–50µm diameter) ball-wedge bonding

Specifications

ManufacturerESEC
Model3100.0
ConditionUsed
Stock NumberTC07092019001