STS Dual Chamber ICP DRIE ASPECT Cluster Etcher (Bosch Process)

STS Dual Chamber ICP DRIE ASPECT Cluster Etcher

(Bosch Process)

STS dual chamber ICP cluster etcher (200mm) configured for Bosch

process. Both chambers are identical in configuration with gases and

corresponding MFC sizes, as shown below:

C4F8    400 sccm

SF6     600 sccm

O2      100 sccm

Ar        50 sccm

CF4      50 sccm

CHF3    100 sccm

HBr      200 sccm

BCl3     100 sccm

Cl2      200 sccm

He       100 sccm

N2       100 sccm

N2       200 sccm