2012 F&K Delvotek 5610

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F&K Delvotek 5610 semiautomatic gold ball bonder with pattern recognition and convertible bond head With the gold ball bondhead 5610, the universal wire bonder processes gold wire from 17,5 to 50 µm thickness on 2inch spool bonds 20 wires per minute The ultrasonic generator provides 60 kHz Bonding head rotates 360 degrees so workpiece does not have to be rotated Integrated PC control with ethernet port Windows based software with intuitive programming single-bond mode for setting single bonds (manual or automatic) and for repairing Multi-wire mode for bonding of complete components manually or automatically. All bond parameters programmable for any number of bonds or bumps Programmed wires are shown schematically on the screen and can be selected and grouped by mouse Numerous programmable loop shapes with automatic correction after adjustment by operator or with the integrated image recognition. Pattern recognition with software dongle and license Firmware version Standard heated workholder for components up to 4"x4" with vacuum and mechanical clamping NFO 09 negative flame off ZFG 010 US power supply Camera with cross hair targeting Leica M80 binocular microscope with tilting ergo-head, ACHRO 0.63x LWD objective, and 10x/23 eyepieces 20W halogen spot light, LED direct light, incident light, ringlight, programmable spotlight 110v, 50/60hz Optional available interchangeable modules for wedge bonding, wire pull test, and shear testing   5610 thin wire bonder for gold ball bonding   5630 thin wire bonder for wedge-wedge bonding   5632 deep access bonder for wire and ribbon   5650 heavy wire wedge bonder for aluminum and copper wire   5650HR wedge bonder for thick aluminum ribbon


ModelDelvotek 5610
Stock NumberEM696