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EVG 520 WAFER BONDER consisting of: - Model: EVG 520 - Manual wafer load substrate bonder - Ca...

Condition: Used Vintage: 1995 Installed, complete, and reported to have no known issues. OEM...

Current configuration: - Wedge-wedge, - Bondhead 60° - e-box Modifications possible upon reques...

300mm Raider ECD310 Sn Ag Plating 4 available Vintage available: 2007 2008 2009 2012

they have two to three metal bond chambers, 20K~40KN, 550C. 6 inch and 8 inch. one smartview al...

EVO (gen.3) which we can install the flip-chip of your need

300mm

Condition: Used,Good condition,Refurbished by Enginneering Solutions. Complete, working, function...

3 units available Installed, idle in fab. It’s in Working Condition. It’s complete with HDD an...

Process Type: Metrology & Inspection Wafer Size: 300mm Date of Manufacture: 2007 Status of Equ...

Process Type: Metrology & Inspection Wafer Size: 300mm Date of Manufacture: Nov 2007 Status of...