TEL CLEAN TRACK LITHIUS Pro V-i
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Description
3 available
300mm
Multi Block (Resist Coater/Developer)
Resist Processing Equipment
General:
· Stack 1: (2) Dev Cups with common arm and (2) NTD Cups with Individual Nozzles
· Stack 2: (2) Dev Cups with common arm and (2) NTD Cups with Individual Nozzles
· Stack 3: (4) COT Cups with (10) Resist Nozzles
· Stack 4: (2) Dev Cups with common arm and 2 NTD Cups with Individual Nozzles
· Stack 5: (4) COT Cups with (6) Resist Nozzles
· (5) SRS for Pre-Immersion Rinse
· (4) PIR for Post Immersion Rinse
· Cassette Block
· (5) FOUP Loadports
· Carrier RFID capability on CSB
· CSB Pressure Sensor
· Main Block with 5 Process Stacks
· Stack 1 & 2 Developer Processing
o (4) Dev cups with (2) common arms and (4) NTD cups with individual nozzle arms
o (2) MGP nozzles with temp control (one for each stack), (4) 2mm NTD nozzles w temp control (one per NTD cup)
o (2) ADR nozzles (1 per stack), (4) PDR nozzles with N2 purge (1 per NTD cup)
o (4) sets of bevel rinse nozzles (1 per NTD cup)
o (8) sets of back side rinse nozzles (1 per cup)
o Bulk FSI system for Developer
o External Thermo Controller System in STHC
o Separate solvent base drain
o Pre-Plumbing for future FIRM field retrofit option
· Stack 3 Coater Processing
o (4) Coater Cups with backside rinse nozzles
o (10) 1.2mm Resist nozzles
o (1) SRRC nozzle with Temp control per stack
o (10) 3ml CRD resist dispense pumps
o (10) Single Bottle Resist Supply Configurations
o EBR angle adjustment capability
o Bulk-FSI system for solvent dispense
o Exhaust Pressure Control (EPC) per stack
o Exhaust duct and drain case cleaning function
o External Thermo Controller System in STHC
o Bevel Rinse nozzle (Ver 2)
o (4) Dispense Detection Systems (COT)
· Stack 4 Developer Processing
o (2) Dev cups with (1) common arms and (2) NTD cups with individual nozzle arms
o (1) MGP nozzles with temp control (one for both Dev), (2) 2mm NTD nozzles w temp control (one per NTD cup)
o (1) ADR nozzles (1 per stack), (2) PDR nozzles with N2 purge (1 per NTD cup)
o (2) sets of bevel rinse nozzles (1 per NTD cup)
o (4) sets of back side rinse nozzles (1 per cup)
o Bulk FSI system for Developer
o External Thermo Controller System in STHC
o Separate solvent base drain
o Pre-Plumbing for future FIRM field retrofit option
· Stack 5 Top Coater Processing
o (4) Coater Cups with backside rinse nozzles
o (6) 1.2mm Resist nozzles and
o (1) SRRC nozzle with Temp control per stack
o (6) 3ml CRD resist dispense pumps
o (6) Single Bottle Resist Supply Configurations
o EBR angle adjustment capability
o Bulk-FSI system for solvent dispense
o Exhaust Pressure Control (EPC) per stack
o Exhaust duct and drain case cleaning function
o External Thermo Controller System in STHC
o Bevel Rinse nozzle (Ver 2)
o (4) Dispense Detection Systems (COT)
· (9) Chilling Adhesion Processing Station (CADH)
o Wafer Wedging function using Plate Temperature sensor SW
o (1) Bubbler Type HMDS Tank located in Main processing block
· (9or12) Slim Chill Plate Process Station (SCPL)
o Wafer wedging function using vacuum detection sensor
· (2or4) Chill Plate Process Station (CPL)
o Wafer wedging function using optical detection sensor
· (19or33) Chilling High Precision Hot Plate Process Station (CPRP)
o A Wafer Wedging function using Plate Temperature sensor SW
o 0.1mm Gap Pin type ceramic proximity pins on chilling arm
· (1) Immersion Process Block (IPRB)
o IPRA Robotic Arm for Wafer Transfer
o (5) Spin Rinse Process Station (SRS) w/IDR nozzle and N2 Capability
o (5) Immersion Edge nozzles (IE) 1 per SRS
o (4) Post Immersion Rinse Process Stations PIR w/IDR nozzle and N2
· (1) Interface Block Sub (IFBS)
o IRAI Robotic Arm for Wafer Transfer
o Interface pulls from both sides
· (1) TEL System Temp and Humidity Controller (STHC)
o (1) Shinwa unit for system environment control, chemical temperature control and CPL temperature control
o (2) Return Air Box - Plenum
· (2) Chemical Cabinets
o (1) HMDS Canister
o (1) 3-Pump Solvent chemical supply system
o (1) 3-Pump NTD chemical supply system
o (1) 2-pump NTR chemical supply system
o (2) 3-Pump Developer chemical supply system
o (1) Sub operation panel
o Top side facility connection
· (1) AC Power Box
o Dual feed supply power with two separate breakers
Top side facility connection
Specifications
| Manufacturer | TEL |
| Model | CLEAN TRACK LITHIUS Pro V-i |
| Condition | Used |
| Stock Number | BM5470 |