K&S 6497 Epoxy Die Bonder
K&S 6497 Epoxy Die Bonder
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Description
- Description Semiautomatic Flip Chip Die Bonder
- Other Information
- ±1.2 Mil @ 3 Sigma Placement Accuracy
- 50 to 3000 grams Bond Force Range
- 10sq. mil – 1000sq.mil Die Size Range
- 19” X 12” XY Stage Travel; 0.5”Z Axis Travel; 0.0003” (0.0076 mm) X, Y, Z Resolution
- 0.2 mrad/motor pulse Theta Rotation
Specifications
| Manufacturer | K&S |
| Model | 6497 |
| Condition | Used |
| Stock Number | BM6276 |