2011 EV Group Gemini

Fully-Automated Wafer Bonder

Wafer Bonding

Date of Manufacture: 2011-12-31

Currently Configured for: 200mm

Bonding Type: The tool does not support anodic bonding.

Piston Type: Hydraulic piston, ideal for high pressure and heat applications.

Purpose: The tool is specifically built for fusion bonding.