2001 Hitachi S-9220

Complete machine with no missing parts and HDD

Stored in climate controlled conditions

Process Type: CD-SEM

Wafer Type

Wafer Specification: 200mm (8in) Notch

Layout Configuration

Specific Layout Definition: Standard

CE Compliance

Details not provided.

Mainframe Configuration

Wafer size: 200 mm

Length measurement method: Cursor and line profile method

Measuring range: 0.1 μm – 2.0 μm

Length measurement reproducibility: ±1% or 3 nm (3σ), larger value

Throughput: 56 wafers/hour (continuous measurement mode)

Secondary electron image resolution: 3 nm (0.8 kV)

Image magnification: Optical: ~110x; SEM: 1k–300k

Reproduction accuracy: 40k–150k–200k (guaranteed to 150k)

Measurement mode: Automatic & Manual

Stage range of movement: X: 0–200 mm; Y: 0–200 mm

Stage drive system: Pulse motor drive

Stage control: Computer, positioning by linear encoder

Stage drive speed: 100 mm/sec (X,Y)

Loader & Wafer Transfer System

Loader: Automatic transfer by wafer transfer robot

Vacuum exhaust: Automatic

Wafer transfer robot: Random access (2 cassettes), vacuum chuck, optical OF/V-notch

detection

Electron Optics

Acceleration voltage: 500–1600V (10V steps)

Lens system: Electromagnetic with booster stock lens

Detection: Scintillator/PMT with EXB filter (SE/BSE 2-stage)

Objective lens diaphragm: Heated thin film, 4 holes, fine adjustment

Scanning coil: 2-stage electromagnetic deflection

Astigmatism correction: 8-pole electromagnetic (X,Y)

Probe current monitor: Built-in Faraday cup

Optical microscope: 1.2 mm FOV, B/W CCD camera

Control & Display System

Observation CRT: 21-inch EWS (GUI)

Scanning mode: TV scan with auto brightness/contrast

Image processing: Software filtering (standard), optional DSP

Image recording: Video printer (optional), file save (optional)

Safety: Emergency shutoff (mushroom switch)

Length Measurement Data Processing

File save: Various measurement condition files

Storage: 9 GB HDD

Auxiliary storage: 3.5-inch MOD, 3.5-inch FDD

Data embedding: Stats (mean, SD), real-time graphing

Print output: 80-digit thermal printer

Vacuum Exhaust System

Method: Fully automatic dry clean exhaust

Pumps: 3 ion, 2 turbo, 2 dry (supplied)

Safety: Protection for power outage, air/water failures

Chemical Solution Configuration

Details not provided.

Workstation Hardware Configuration

Details not provided.

System Software/Automation

Details not provided.

Electrical B89

Details not provided.

Ancillaries

Details not provided.

Hook-up Connection / Requirements

Details not provided.

Options

Details not provided.

Target Process Performance

Details not provided.