EVG 520 Wafer Bonder

EVG 520 WAFER BONDER consisting of:

- Model: EVG 520

- Manual wafer load substrate bonder

- Capable of fusion compression bonding

- Capable of thermal compression bonding

- Capable of anodic bonding

- Ideal for R&D and pilot production applications

- High-vacuum capable bond chamber

- Auto opening of bond tool cover

- Windows based control software and operation interface

- Wafer size: up to 150mm capable

- Vacuum chuck: 6"/150mm diameter chuck

- Max Bond Force: 7 kN

- Top side heater: 550°C max. in 1°C steps

- Bottom side heater: 550°C max. in 1°C steps

- Thermoflex 1400 Chiller (or equivalent) 

- Temperature uniformity: ± 1,5 %

- Turbo pump and controller

 - Roughing pump

- Load/unload tool

- System computer, monitor, and keyboard

- Operations Manual for EVG 520 Bonder