BAL-TEC (Gartan) SCD005

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Used BAL-TEC (Gartan) SCD005
Process: sputter coater Condition: working Wafer size: multi

2009 SEMILAB WT-2000PVN

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Used 2009 SEMILAB WT-2000PVN
Process: lifetime measurement Condition: complete

BMR HiEtch-LX200

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Used BMR HiEtch-LX200
Process: ICP etcher Wafer size: 12" Condition: as is

1999 Tel ACT 8

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Used 1999 Tel ACT 8
Wafer size; 8" Process: track Condition: part tool

Nikon OPTIPHOT 300

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Used Nikon OPTIPHOT 300
Process: microscope Condition: complete (1) as is (1) Wafer size: 12"

2002 DNS 80B

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Used 2002 DNS 80B
Condition: as is Wafer size: 8" Process: track

AMAT P5000

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Used AMAT P5000
Process: Preclean Etchx1, Oxide CVD x2 Condition: as is Wafer size: 8"

ASML Yieldstar-S1250

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Used ASML Yieldstar-S1250
Process: Overlay Measurement Condition: as is Wafer size: 12"

2004 Rudolph AXI-S

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Used 2004 Rudolph AXI-S
Process: Macro Defect Inspection Condition: as is Wafer size: 12"

2009 Rudolph MP3 300XCu

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Used 2009 Rudolph MP3 300XCu
Process: Thickness Measurement Wafer size: 12" Condition: as is

2011 Camtek AIM1 (Xact200)

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Used 2011 Camtek AIM1 (Xact200)
Process: analyzing Condition: as is