Vintage: 2013 Option: BBD, NCS Working hours: 8500 hours Good Condition Spindle: 18kw

Good complete condition Vintage: 2012 Wafer Size: Runs up to 200mm

- 1.8KW Spindle- NCS & BBD- High/low resolution microscope- 8” chuck table, has 6” table but extr...

Dicing saws, used for 6" wafer Used

Dicing Tool Used

Automatic Dicing Saw, Tool

Vintage 2012 CE Marked NCS: Yes BBD: Yes 6 or 8 inch chuck available

Process Laser saw Vintage 2009 Wafer Size 8 inch ( Max Workpiece Size 12 inch) Voltage 200~240...

BACK GRINDER WAFER SIZE 6"

Very good condition Came from a lab in Japan Low hours

- 2008 year - Very low running hour (Less than 600Hr)