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We can supply used semiconductor equipment in excellent working condition including refurbishment and installation. TaraSemi.com can offer you a turn-key solution at competitive prices.
We also have a large inventory of Spare parts; we can source obsolete and difficult to source parts and offer second source parts.
Featured Equipment
Featured
2022 Edwards EUV3050H / iXH3050H harsh vacuum pump
Contact us for price
OEM: Edwards
Model: EUV3050H MK2 HV MM44 INT
AKA: iXH3050H configured for EUV scanners. It was ...
Featured
Asyst Versaport 2200 Indexer
Contact us for price
We have a refurbished Asyst Versaport 2200 Indexer for sale.
Part number: 9700-5384-01 REV.4
It...
Featured
Ebara EV-S100N Dry Vacuum Pump NEW
Contact us for price
- Ebara EV-S100N
- Dry Vacuum Pump
- SPN: 202249-I51
- Condition: New
- Serial: DKF00944
-
Mode...
Featured
Edwards IGX100M Vacuum Pump
Contact us for price
- Edwards IGX100M Vacuum Pump
- iGX100M
- SPN: NR5150000
- 200-230V, 50-60Hz 12 Amps
- Condition:...
Featured
2011 Yushin WSS Demount Tool DM5
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Condition: Very Good Yushin Demounter 4 3 Teile Condition Very Good Year of Manufacture 2011 Wafer Size: ...
Featured
2004 Semitool SST-C-642-250
Contact us for price
Can be sold As Is or can be configured to meet your requirements
Batch Wafer Processing
Etch/Cl...
New To The Market
2025 Disco DTG 8460
Contact us for price
300mm taiko grinder (DTG 8460)
Available now
Original packaging
Wafer Size RangeMinimum300 mmM...
1997 Teradyne A565
Contact us for price
9 available
Number of Test Heads1
Year of Manufacture1997/ 1998/ 2000 (2)/ 2003 (2)/ 2006/ 2001...
2018 Teradyne MicroFLEX
Contact us for price
DescriptionTESTER_TERADYNE MICROFLEX_MKZEMFLEX75TESTER_TERADY
Year of Manufacture2018
Condition...
2017 Teradyne ETS-88TH/AC-2500
Contact us for price
CATEGORY:Digital Test Systems Year of Manufacture2017 ConditionGood
ESEC 8003 Dicing Saw
Contact us for price
Specification:
Diameter of substratum disc (wafer): 25,4 - 152,4 mm (1" – 6")
Thickness of subs...
2025 Disco DTG 8460
Contact us for price
300mm taiko grinder (DTG 8460)
Available now
Original packaging
Wafer Size RangeMinimum300 mmM...
1997 Teradyne A565
Contact us for price
9 available
Number of Test Heads1
Year of Manufacture1997/ 1998/ 2000 (2)/ 2003 (2)/ 2006/ 2001...
2018 Teradyne MicroFLEX
Contact us for price
DescriptionTESTER_TERADYNE MICROFLEX_MKZEMFLEX75TESTER_TERADY
Year of Manufacture2018
Condition...
2017 Teradyne ETS-88TH/AC-2500
Contact us for price
CATEGORY:Digital Test Systems Year of Manufacture2017 ConditionGood
ESEC 8003 Dicing Saw
Contact us for price
Specification:
Diameter of substratum disc (wafer): 25,4 - 152,4 mm (1" – 6")
Thickness of subs...
Latest News
Refurbished vs. New Semiconductor Process Pumps — What You Need to Know When a major European fab experienced a sudden iH1000 failure during a process, every hour offl...
Background:Tarasemi, as a trusted intermediary in the semiconductor industry, was tasked with overseeing a substantial equipment transfer of an ASML PAS5500/300C betwe...
In today's dynamic tech landscape, businesses need to be prudent about their investments. This includes considering alternatives when sourcing essential machinery, lik...