ASM Siplace CA4 with 4 Siplace Wafer Systems 8inch SIPLACE CA4: - High Volume Chip Assembly - ...

Hughes Palomar 2470 series V wire bonder with associated components / scope. Numerous spare parts...

K&S Model 4523 Manual Wedge Wire Bonder, with Block AIM 10/5 Transformer See brochure attached f...

HESSE & KNIPS, PIEZO BONDJET BJ820 WIRE BONDER DESCRIPTION Includes Hesse DA 04 051 Deep Access...

Wafer size 3” but can go to 6in Bond Force:20KN Plasma Primer – NO Process : Fusion of 3/5 mat...

Sold in Working condition

3 AVAILABLE WORKING STANDARD CONFIGURATION

Complete and in working condition ADT 7100 Dicing Saw - UPS for the machine - Spare parts / ad...

working condition