Nitto Seiki DR8500 150mm / 200mm Wafer Taping Tool – 2001

Manufacturer: Nitto Seiki

Model: DR8500

Year: 2001

Condition: Used – Good Condition

Wafer Size: 150mm / 200mm (6" / 8")

Current Configuration: 150mm (6")

Location: Europe

Availability: August 2026

Quantity: 1 Unit

Price: Contact for Price

Description

Used Nitto Seiki DR8500 Wafer Taping System for semiconductor wafer processing.

The system supports 150mm and 200mm wafers (6-inch and 8-inch) and is currently configured for 150mm wafer processing.

The equipment is located in Europe and is expected to become available in August 2026.

The system is reported to be in good condition, with spare parts available.

Specifications

• Manufacturer: Nitto Seiki
• Model: DR8500
• Application: Wafer Taping
• Current Set Size: 150mm
• Year of Manufacture: 2001
• Condition: Good
• Power Supply: 230 VAC
• Frequency: 50/60 Hz
• Phase: Single Phase
• Spare Parts: Available
• Quantity Available: 1

Major Components

The system configuration includes:

• Main system frame
• Wafer handling system
• Wafer aligner
• Cutter unit
• Wafer handling robot
• Operator interface / control panel

Availability

Available August 2026

Location: Europe

Equipment is offered as-is, where-is.

Deinstallation, rigging, packaging, crating, international shipping and installation support can be quoted separately upon request.