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Esec 2008XP x2set Die Attach
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wafer size setup : 8inch package : IC package setup Input : stack leadframe output : magazine Dis...
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ASM AD809A-03 x1set
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Hughes 2460-II hybrid bonder, 4?x4?
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FICO TFT.M trim and form press
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FICO TFT.M trim and form press
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F&K Delvotek 6110 bonder
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Die Bonder ESEC 2006
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