Equipment Configuration: – set up for oxygen plasma cleaning of aluminum parts

AMAT E500 › Original Equipment Manufacturer? (Yes/No, if no please state the details ) Yes4› Exa...

Thin Wafer handling Hydrogen Implanter, E500 Year of Manufacture2013 Exterior Dimensions Width...

Year Manufactured: 2003

The unit was never installed and remains in new, unused condition

Swissline Die Sorter (Pick & Place) Transferring die from sawn wafer (mounted frame) to tape and...

Two Datacon EVO Eutectic Multi Chip Die Bonders available, Vintage 2011 & 2013 The Bonders will...

This West-Bond 7476E-79 Convertible Wedge-Wedge Wire Bonder (s/n 16239) looks to be in good cosme...

BARE WAFER INSPECTION 300mm HDD will not be included, · Defect Inspection · Two Load Ports · ...

AOI Condition: used Included separate standalone Programming station

ManufacturerACA Integration ModelAQN2D2 DescriptionEAV_ACA AQN2D2_EAV003 Year of Manufacture20...

Have 5 nos of switchgears Description VD4 Condition Good Year of Manufacture 1996Exterior Dime...