Process: Furnace(ALD NITRIDE) Condition: initial passed Wafer size: 12"

Process: CVD Wafer size: 4" Condition: as is

Process: BCD PLOY Condition: AS-IS Wafer size: 12"

Very little used, in top condition Data sheet (in German) in attachment

Chemical Vapor Deposition (CVD) Wafer Size: Equipment Configuration: – SBC Board Model: SV21 –...

Type: Chemical Vapor Deposition (CVD) Equipment Configuration: – 2 Chambers

Type: Semi-Automatic Probe Station Wafer Size: 8"

Handler

Type: Field Emission Scanning Electron Microscope (FE-SEM)

LAM Alliance 4.1 ICP Etcher 2set

USHIO INC. uX-4440 Aligner

CHA Revolution E-Beam