2018 Meyer Burger DW288 S3

Meyer Burger Wire Saw Series 3(DW288)

All units are currently powered down, and stored in the factory.

They are in perfect working condition - we can arrange to test upon inspection

The current owner purchased them new from the OEM.

Mastering Diamon Wire Technology Features

Highest Quality and Precise Wafers

TTV < 10um

Thinnest wafers down to 100 um

Higher wire tension due to tight wire tension control and wire tension decoupling

Highest Yields for mono and multi silicon

Highest Throughput

25% faster cutting time

Up to 35 MW capacity

20% fewer tools

25% more wafers per unit of time

Up to 7 million wafers per year

Reduction of operating costs

Best material utilization

Thinnest wires down to 60 um

Eco-friendly water-based sawing process

Technical Data (DW288 Series 3)

Wire web length [mm] 650

Max workplace dimension [mm] 165 x 165

Min. wafer thickness [um] 100

Workpiece holders [mm] 1x 650 / 2x 325

Max. wire speed [m/sec] 30

Cutting Fluid Water-based

Wire guide roller axis distance [mm] 390

Footprint incl. service area [m2] 17.4