TEL Mark8

Condition: Used

Operational Status: Installed / Shut-Down (de-facilitized in fab)

Wafer Size: 8"/200mm

Vintage: 1997

Description: Complete, Working Condition, with no missing parts. Last used Q1 2023

Main Body Configuration

-Standard configuration includes items listed below

- (2) Coater module, including: Three (3) coat dispenses, 3 x TalonTech TP-12 pumps, max 1,000cP, Solvent Pre-wet, Programmable Topside Edge Bead Removal (TEBR), Back

- Rinse, solvent bath, customer supplied resist/solvent filters, programmable motor flange temperature control, programmable resist fluid temperature control, 10L local drain

- Tanks, rear exhaust connections

- (1) Developer module, including: Two H-nozzles, top and bottom D.I. Water rinse, customer supplied Develop/D.I. water filters, programmable motor flange temperature control, programmable develop fluid temperature control, 10L local drain tank, rear

- Exhaust connections

- (3) Digital vacuum sensors interlocked (one on each Spin Unit Process module)

- (1) Adhesion Plate (AD) thermal unit

- (6) Hot Plate (HP) thermal unit

- (5) Cool Plate (COL) thermal unit

- (1) Triple robotic substrate transfer arm with Teflon centering blocks

- (1) Carrier Station with four (4) cassette locations and vacuum free transfer arm

- (1) System Environmental Enclosure with FFU’s

- (1) Internal Rack (FTC), including: 2 Thermo-con circulation units, 1 SMC Thermo-con controller unit, 5 cooling power supplies

- (1) Internal Resist/Canisters/HMDS bubbler-drain bottle storage: Three 1 gallon resist bottles, HMDS bubbler and drain containers, two 1-gallon canisters – one for solvent;

- Two supplied for develop but QD’s to allow operation of one develop canister at a time

Inside System

- (1) AC Power Distribution Transformer, 480v/3 phase type

- (1) Recipe Cascading and Parallel SW option configuration activation

- (1) ARDiMuS, With SECS communication – with BU included

- (1) SEMI S2-93 safety compliant