DYNATEX Wafer Scriber/Breaker DX-111

DYNATEX Wafer Scriber/Breaker DX-111

orCall +353 (0) 87 192 1110

Description

Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System Internal PC Control System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM

Specifications

ManufacturerDYNATEX
ModelDX-III
ConditionUsed
Stock Number53280.0