DYNATEX Wafer Scriber/Breaker DX-111

DYNATEX Wafer Scriber/Breaker DX-111
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Description
Wafer Scriber/Breaker For Scribing & Breaking of up to 4” Wafers Chip Free™ Breaking Mechanism Uses Impact Breaking System Minimum Die Size: 0.005” Square (125µ) Wafer Thickness Range: 0.004” (100µ) to 0.039” (975µ) CCD Camera Alignment System Internal PC Control System DOS Operating System Operators and Maintenance Manuals Facilities Required: Input Voltage: 115VAC, 60Hz, 5A CDA or N2: 60-85 PSIG, 0.5 CFM Vacuum: 15-28 In. Hg, 0.5 CFM
Specifications
Manufacturer | DYNATEX |
Model | DX-III |
Condition | Used |
Stock Number | 53280.0 |