ASM Wafer Die Sorter MS899-DL

ASM Wafer Die Sorter MS899-DL Equipment Description ASM Model Number: MS899-DL Year: August 2008 Cycle Time: 175ms XY Placement: +/- 1.5 mil Die Rotation: +/- 3degrees Collect type: Surface pick type Pick/Bond force: 40 - 250 g (adjustable) Bin frame capability: Max 150 100 - buffer bin cassette 25 - empty bin cassette 25 - finished bin cassette Bin Frame Size: 175 mm (I.D.) / 195 mm (O.D.) Effective binning area: 58 x 58 mm2 Size of mylar sheet: 195 x 195 mm2 Wafer loader capacity: Disco Ring 25 / Foton Ring 12 Die Size Handling w/look ahead - 9 x 9 mil2 - 50 x 50 mil2 (0.23 x 0.23 mm2 - 1.27 x 1.27 mm2) Die Size Handling w/o look ahead - 9 x 9 mil2 - 150 x 150 mil2 (0.23 x 0.23 mm2 - 3.81 x 3.81 mm2) Package Size handling w/look ahead - 240 x 240 mil2 Package Size handling w/o look ahead - 480 x 480 mil2 Dimensions: 1448mm x 1486mm x 1626 mm Weight: 100 kg Power Requirements: 110 Volt -  50/60 Hz