Tokyo Electron Ltd. Expedius

Tokyo Electron Ltd. Expedius Batch Wafer Processing

Currently Configured for 300mm wafer size

MFG Date: TBC

EQUIPMENT DETAILS:

 Tool is currently located in on-site storage.

Labelled as Collateral Assets.

[Bath 1]

 LAL30(20deg,16.5l/min)

 Bath material :PTFE

 Chuck material :PCTFE

[Bath 2]

 Cold DIW rinse(25deg,40~80l/min)MFB

 Bath material :Quartz

[DRYER1]

 type SD2

 1:200DHF

 IPA/N2 200deg

 100l/min

[DRYER2]

 type SD2

 1:200DHF

 IPA/N2 200deg

 100l/min

Other options:

 Chemilcal filter for acid removal and organic removal