2016 Ulvac SIV 500 ITO Sputter System

 • 3-station process module (P1, P2, P3)  

 • 5 kW pulsed DC power supply  

 • P3 dedicated to ITO or other TCF  

 • P3 has O₂ MFC & 13.56 MHz power supply/match to maintain ITO stoichiometry  

 • L/L has roughing pump and water pump  

 • Process chamber has roughing pump, T-ed to turbo/water pump & cryo pump

• manual load, (1) 500 × 500 mm carrier; uses Ulvac 12" cryo & 12" water pump/turbo

The ULVAC SIV-500 is a versatile in-line sputtering system used for thin-film deposition, featuring a large 500mm x 420mm vacuum chamber and multiple sputter sources on an XYZ stage. It supports high-rate, uniform sputtering with capabilities for low-temperature and bias sputtering, handling substrates up to 8 inches in diameter. The system includes a load-lock for efficient substrate handling and offers features for precise control over the deposition process.  

Key Features and Capabilities

• Large Vacuum Chamber: 

A 500mm x 420mm chamber provides ample space for processes and handling larger substrates. 

• Multiple Sputter Sources: 

Equipped with three magnetron sources and one DC planar source, allowing for various deposition materials and configurations. 

• XYZ Stage: 

The sputter sources can be moved on an XYZ stage for flexible and precise material placement on the substrate. 

• Low-Temperature Sputtering: 

Allows for the deposition of films without excessive heat, which is important for certain applications. 

• Bias Sputtering: 

Enables control over film density and properties by applying a negative bias voltage to the substrate during deposition. 

• Substrate Handling: 

Features a load-lock for loading substrates and can handle wet process cassettes weighing up to 5 kg, accommodating up to three substrates at a time. 

• Process Control: 

Includes monitoring software and an on-board computer for real-time control of process parameters and for detailed process documentation. 

Applications

The ULVAC SIV-500 is suitable for various thin-film applications, including:

• Semiconductor Manufacturing: 

Used in processes for creating computer chips, including creating thin film layers with desired properties. 

• Advanced Material Deposition: 

Its versatility makes it ideal for research and production of high-quality thin films for cutting-edge material science.