2014 Ulvac SIV 200 ITO Sputter System

 • 3-station process module (P1, P2, P3)  

 • 5 kW pulsed DC power supply  

 • P3 dedicated to ITO or other TCF  

 • P3 has O₂ MFC & 13.56 MHz power supply/match to maintain ITO stoichiometry  

 • L/L has roughing pump and water pump  

 • Process chamber has roughing pump, T-ed to turbo/water pump & cryo pump

• auto-load (3) 6" wafers on 200 × 200 mm carrier; front-end stocker holds 6 carriers; uses Ulvac 10" cryo & 10" water pump/turbo

The ULVAC SIV-200 is a versatile, in-line vacuum sputtering system designed for high-efficiency thin-film deposition in the semiconductor, electronics, and display industries. It uses single-source reactive magnetron sputtering to create high-transparency and other specialized films on large substrates. Key features include high deposition rates, the option for multiple targets, and advanced process control for both conductive and insulative films.  

Key Features and Capabilities:

• High-Efficiency Sputtering: 

The system is known for high deposition rates, potentially reaching up to 50nm/min or more, depending on the target and process. 

• Single-Source Reactive Sputtering: 

It utilizes a single-source RF magnetron to deposit oxide films like ITO and A-Si, reducing contamination risk and improving uniformity. 

• Multi-Target Capability: 

The SIV-200S variant allows for simultaneous deposition from up to four targets, enhancing throughput. 

• Advanced Materials and Films: 

The system can handle the deposition of both conductive and insulative films, including high-transparency films for display applications. 

• High-Temperature Oxidation: 

An integrated high-temperature atmospheric-pressure oxidation chamber is available to deposit refractory oxide films with high oxidation rates and film purity. 

• Applications: 

Ideal for large substrates, particularly for flat panel display production and various thin-film applications in the electronics and semiconductor sectors. 

• ULVAC Technology: 

The SIV-200 leverages ULVAC's extensive experience in vacuum technologies, process data, and design principles for user-friendly and high-performance equipment.