2021 SPTS Omega fxP Etch System

This System will be built to standard specifications according to the

configuration below:

* fxP Transport Module

* One Dsi-v Process module

* One ICP Process module

* One Isopod Process module

* System configured for 200mm wafers

* 4-color Alarm Tower

* Extended 20m metre Electrical lines (free cable length)

* Power distribution cabinet

* UPS (uninterrupted power supply)

* Ancillaries cabinet

* Through wall or ballroom installation kit

* Bracket-mounted monitor and keyboard

* Maintenance laptop for rear control

* Standard setup tool kit

fxP Transport Module

* 8-port transport module

* Brooks dual pan robot

* Two vacuum cassette elevators (VCE’s)

* Wafer alignment & centraliser as required for process

* SMIF interface kit (Seller to supply 2 x Fortrend SMIF pods)

DSi-v Process Module

* Bosch process deep Si module

* Source RF generator

* Bias RF generator

* Bias variable matching unit

* Source solid state matching unit

* Heated VAT pendulum valve

* Extracted gas box containing 6 digital MFCs (2 additional

MFCs available)

* Temperature managed Maglev turbo pump

* Chamber capacitance manometer (1.0 torr)

* Optical endpoint system

* Wafer Edge Protection (WEP) kit

* Electro-static chuck, PSU & He back-pressure control

* Heated lower chamber & upper chamber

* Foreline heating

* Chamber shielding as required for process

Options:

* Two additional gas lines

ICP Process Module

* Low pressure, high density plasma

* Source RF generator

* Bias RF generator

* Bias variable matching unit

* Source variable matching unit

* Heated VAT pendulum valve

* Electro-static chuck, PSU & He back-pressure control

* Heated lower chamber & lid

* Optical endpoint system

* Extracted gas box containing 6 digital MFCs (2 additional

MFCs available)

* Temperature managed Maglev turbo pump

* Chamber capacitance manometers (0.1 and 1.0 torr)

* Foreline heating if required by process

* Chamber shielding as required for process

1

Options:

* Two additional gas lines

Isopod Process Module

* High pressure, downstream plasma

* Source RF generator

* Source solid state matching unit

* Wafer heating using hot paddle, ambient to 300°C

* Extracted surface mount gas box containing 4 digital MFCs

* Chamber capacitance manometer (10 torr)

Dsi V Etch:

Silicon Etchback fullsheet only (~50um)

ICP Etch:

It’s a stack of AlN and TiN

ICP Isopod :

It’s a GaN Etch (clear parasitic GaN growth leaving a smooth Si surface with photoresists mask).