2013 Bruker Contour GTX

Application: White Light 1501

Wafer size: 6“

Year of Manufacture 2013

The ContourGTX tool is currently connected to the Wafer Sorter.

The wafer sorter is loading / unloading wafers into the Contour GTX.

The Contour GTX cal also be purchased without the CHAD Wafer Sorter.

Any future Software upgrade with the Bruker ContourGTX will make the use of the wafer sorter impossible.

When integrated with an automated wafer handler, metrology control and SEC-GEM compatibility, a WLI profiler will boost yield and drive process optimization, all with a minimized footprint in cleanroom-constrained spaces.

Besides covering a wide range of topology using a single measurement head with a unique optical column, Bruker's WLI profilers provide another unique capability: vertical resolution that is both independent from the magnification/objective used and operates at sub-nanometer-levels. Advanced packaging characterization benefits greatly from these characteristics. WLI opens up the opportunity for defect review on interconnect layers with dense bump arrays or bump recesses, capturing large fields of view while maintaining vertical resolution

High confidence in vertical resolution also boosts performances of regular planar CD metrology, such as width and spacing of the redistribution layer (RDL) or offset calculations for overlays (OVL) between successive layers in 3D integration structures. In die stacking or die-to-wafer hybrid bonding, PSI mode, together with stitching, helps to accurately capture the full die flatness with micrometer lateral resolution and nanometer reproducibility. Thus, chemical mechanical polishing (CMP) can be optimized upon specific die layouts.

Vision64 software Version: V5.41 (V5.6 can also be installed and Installation CD is included.

· Optional software: None

· Turret Functions / No. of positions: Can be turned automatically and has 5 positions. One position is free.

· Objectives: 3 Interferometry Objectives (5x, 20x, 50x) and one brightfield objective (10x). Furthermore you can add automatically a further lens in the beampath, which gives you the possibility to additionally change the magnification. This second turret has the magnifications 0.55x, 1x and 2x. Combining e.g. the 50x Objective with the 2x magnification lens results in a magnification of 100x.

· FOVs (in µm):

5x: 1261,1 x 945,9

10x (BF): 568,8 x 426,6

20x: 314,3 x 235,7

50x125,7 x 94,3

The above FOVs are with the “magnification lens” 1x. If you add the 0.55x, you get a final FOV for the 50x of 228,6 x 171,4. If you add the 2x to the 50x, the resulting FOV is 62,9 x 47,1. (Units are µm)

· Step height standard information: Easy calibration possible by a guided menu. The calibration can be done in a few steps with a step height standard or you can use the integrated “Optional auto and continuous internal laser signal” for calibration.

· Air-table: Fully functioning and usable for vibration compensation

· X-Y Stage size: Capable for 4, 6 and 8 inch wafers (Handling System and Contour). The Stage can be moved 210,94 mm in x and 211.84 mm in y for the tool with the older stage. The new stage can be moved 308,6 mm in x and 309 mm in y

· X-Y stage Function / Limit switches on all axises: Yes. Automatic initialization is working.