Zen Voce Corporation BM388

• High Speed Linear Pick & Place Robots
• Theta axis on stage for precise flux and ball position
• Application both of carrier & substrate type ball mount process
• Z axis height precise position by motorized lifter
• Substrate placement press module
• Max 15mm warpage substrate available
• Substrate orientation inspection thru vision (PMI, Carrier type)
• Rock & fill ball bin module
• Tool damage protection feature using Quickstop
• Highly flexible system with user friendly GUI
• Variable speed control for Flux & Ball sweep with software parameter setting (beneficial for process evaluation)

Carrier

Length min 150min ~ max 325mm

Width min 50min ~ max 170mm

Placement area (Length) max 320mm

Placement area (Width) max 130mm

Thickness min 1mm ~ max 8mm

Ball size min 0.30mm ~ 0.76mm and above

Ball Pitch min 0.50mm ~ 1.50mm and above

Substrate

Length min 150min ~ max 300mm

Width min 50min ~ max 100mm

Placement area (Length) min 140mm ~ max 290mm

Placement area (Width) min 45mm ~ max 95mm

Thickness min 0.5mm ~ max 2mm

Ball size min 0.15mm ~ 0.76mm and above

Ball Pitch min 0.30mm ~ 1.50mm and above

Achievable number of balls per mount cycle 60,000 balls

PMI resolution 0.020mm/pixel (Option 0.014mm/pixel)

Vision accuracy +-0.03mm@3sigma

Ball placement accuracy 1/3 ball offset