2025 Disco DTG8440 Taiko Process

The DISCO DTG8440 is a fully automatic taiko-grinding system designed for high-precision thinning of semiconductor wafers.

Key Features

• 2 Low Vibration Air Bearing Spindles
• 2 Probe Height Gauges for Measuring
• Automatic wheel set-up function
• Edge clamping on transfer arms 2 and 3 instead of vacuum pads
• Fixed-position stop function for the chuck table and spinner table
• In-process wafer thickness measurement on Z1 and Z2
• Non-Contact Thickness Gauge for normal and high doped wafers
• Non-recirculating Cutting and Cleaning Water System
• Reserve air switching unit for spindle air bearing protection
• Robotic Wafer Transportation System
• Signal Tower
• Spindle Cooling Water System
• Spindle Rotation Speed Monitor
• T2-arm with vacuum pad, not edge clamping
• Taiko-grinding of 8”-wafers with V-notch
• Transfer arm 3 (T-arm in spinner table area) with vacuum pad for 8” wafers with V-Notc
• Turntable with 3 Chuck Tables for 8”-wafers with V-notch
• Vacuum maintenance using vacuum ejector
• Vacuum Pump System
• Wafer Cleaner with spinner table
• Z-Axis Indices
• Wafer backside washing function
• Vacuum maintenance using vacuum ejector
• SECS/HSMS