2014 BESI/ESEC 2100 FC Die Bonder-Flip Chip
2014 BESI/ESEC 2100 FC Die Bonder-Flip Chip
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Description
BESI/ESEC 2100
The unit is still installed and operating in production.
- Track width: 125mm
Specifications
| Manufacturer | BESI/ESEC |
| Model | 2100 FC Die Bonder-Flip Chip |
| Year | 2014 |
| Condition | Used |
| Stock Number | BM7303 |
| WAFER SIZE | 8 inch Wafers |
| * Track width | 125mm |