2014 BESI/ESEC 2100 FC Die Bonder-Flip Chip

2014 BESI/ESEC 2100 FC Die Bonder-Flip Chip

Contact us for price

Available quantity:1

or
Call +353 (0) 87 192 1110

Description

BESI/ESEC 2100

 The unit is still installed and operating in production.

  • Track width: 125mm


Show All

Specifications

ManufacturerBESI/ESEC
Model2100 FC Die Bonder-Flip Chip
Year2014
ConditionUsed
Stock NumberBM7303
WAFER SIZE8 inch Wafers
* Track width125mm