DYNATEX DX-III

Status: excellent

Application: scribing

◆ PRODUCT BENEFITS:

Zero kerf loss allows higher die density on the wafer

Increased production rates

Chip free results

Less residual stress

No toxic water discharge

No D.I. water costs

More real estate; narrower street widths

◆ PRODUCT FEATURES:

Automatic

Capable of complete, automatic scribing and breaking of many substrate materials

Cost effective

- System integration allows easy hook-up and transport

- Superior yield and improved efficiency

- Reduced production time

Environmental

No DI or toxic waste water

Versatile

- Fully programmable for all scribing and breaking parameters, including TrueAngle™

diamond tool positioning

- Infinitely programmable with Pentium™ powered Windows™ interface

Easy

Few operator adjustments are required when changing between wafer types

◆ SPECIFICATIONS:

Wafer Size:

150 mm max. (6 inch max.)

Minimum Wafer Index:

5 um with Std. Encoders; 1 um with Optional Hi-Res. Encoders

Maximum Wafer Index:

150 mm

Break Method:

Patented impulse bar

Vision System:

Digital Hires BW/Color Camera; 17" Color Monitor; Pattern Recognition System for Auto Alignment, Edge Detection, and Auto Step-Correction

Programmable:

Scribe Tool Life; Scribe Angle; Scribe

Approach Speed; Scribe Force; Scribe Speed

Scribe Extension; Break Force; Multiple Die

Size; Fiducial Image Storage; Wafer Type and Profile; Multiple Wafer Profile Storage. (Profiles programmable in metric or imperial units.)

Wafer Mounting:

Std: Metal Saw Frames (Max 6" wafers - FF105/DY-NFR-007 and FF108/DY-WFR-001; Max 4" wafers - 6" hoops and 7" hoops)

Substrates:

GaAs, LiNbO3, Glass, InP, GaP, Silicon, Quartz