- Wafer Size: 300 - Group: Electronic - Category: Semiconductor Assembly & Packaging - Family: Di...

Two Backgrinders still installed Complete and in working condition

Sold in good working condition

Working condition Including NCS option

DAD341 with 2.2kw spd (uses 3" blades), NCS, single objective lens, spindle cooling flow senso...

200mm As-is Used Fully Automatic Dicing Saw

- 8 inch Silicon Wafer Saw - Dual Spindle - NCS - BBD

200mm As-is

150mm As-is

WP-BG-05 Back-side Grinder

WP-BG-04 Back-side Grinder