Tresky T-3002-FC3 FLIP CHIP DIE BONDER WITH 200MM WAFER STAGE AND EUTECTIC

Contact us for price
Used Tresky T-3002-FC3 FLIP CHIP DIE BONDER WITH 200MM WAFER STAGE AND EUTECTIC
CONFIGURED WITH: 100MM SQUARE EUTECTIC HEATED WORK HOLDER EPOXY STAMPING FLIP CHIP BEAM SPLITT...