Die bonder for sale at Tara Semiconductor Technology

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Used ESEC 2008SC3 Plus

Manufacturer: ESEC Type: Die Bonder Model: ESEC 2008SC3 Plus Description: ESEC 2008SC3 Plus Sm...

Used ESEC 2008HS3 Plus

ESEC 2008HS3 Plus Die Bonder refurbished condition Configuration – 12” wafer table, Writing dis...

Used ESEC 2007IC8

Manufacturer: ESEC Type: Die Bonder Model: 2007IC8 Description: ESEC 2007IC8 Die Bonder

Used ESEC 2006HR

Manufacturer: ESEC Type: Die Bonder Model: 2006HR Description: ESEC 2006HR Die Bonder

Used ESEC 2008XP3

Manufacturer: ESEC Type: Die Bonder Model: ESEC 2008XP3 Description: ESEC 2008XP3 Die Bonder

Used ESEC 2008 HL

Manufacturer: ESEC Type: Die Bonder Model: 2008 HL Description: ESEC 2008HL Die Bonder