ESEC 2008HS3 Plus
ESEC 2008HS3 Plus
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Description
ESEC 2008HS3 Plus Die Bonder refurbished condition
Configuration – 12” wafer table,
Writing dispenser,
TOS input,
Magazine output,
wafer map,
OBC,
PostIQC.
Specifications
| Manufacturer | ESEC |
| Model | 2008HS3 Plus |
| Condition | Used |
| Stock Number | em2375 |