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AMAT P5000 RIE
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RIE 150mm SiO2, SiNx & Si 2 chambers with full gas panel Computerized endpoint system ESC wa...
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Shimadzu Shimadzu LabSolutions LCMS LCMSSolutions Software, USB License Dongle
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2008 TEL Indy IRAD
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Tool Status Running Wafers Wafer Size 300 mm Fab Section Diffusion Asset Description TEL Furna...
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2006 TEL Lithius
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Tool Status Connected Wafer Size 300 mm Fab Section Lithography Asset Description Coat only To...
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2015 FEI ExSolve CLM next Gen, 300mm
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FEI, ExSolve CLM next Gen, 300mm, Tool ID: FIB2103
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2009 ASM ASM3200
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Tool Status Connected Size 300 mm Fab Section Diffusion Asset Description Epsilon3200 Single W...
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2016 FEI ExSolve CLM next Gen, 300mm
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FEI, ExSolve CLM next Gen, 300mm, Tool ID: FIB2104
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2008 TEL P12XLn
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TEL, P12XL, 300mm Tool ID: 33B7TA TEL P12XL Prober dual foup VIP3
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2004 TEL P12XLn
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TEL, P12XLn, 300mm Tool Status Disconnected Wafer Size 300 mm Fab Section Test Asset Descript...
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2011 KLA-Tencor Uvision 5
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Tool status: Cold Shutdown Software version: 788 CIM: E84, SECS/GEM, GEM300 Hardware Configura...
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2013 TEL LTI unit
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TEL, LTI unit Tool ID: LTI12007
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2012 AMAT UVC
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Process UVC process Missing/ Faulty Parts/ Accessories List: Boards, Heater p 2
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