2019 YES EcoClean

2"-8" Wafer Capability

-Controlled strip rate – 100-100,000 Å/min (0.01 – 10 um/min)

-High throughput – up to 65 wph process

-Small footprint with single chamber

-No defects or damage due to ICP Downstream Plasma

-R&D to high volume production with minimal downtime

Photoresist removal

PR descum

Polyimide removal

Organics removal

Copper oxide removal