ESEC 2008HSE+
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Description
Semiconductor assembly & packaging
Bonding equipment
Epoxy die bonder
Specifications
| Manufacturer | ESEC |
| Model | 2008HSE+ |
| Condition | Used |
| Stock Number | BM1900 |
Semiconductor assembly & packaging
Bonding equipment
Epoxy die bonder
| Manufacturer | ESEC |
| Model | 2008HSE+ |
| Condition | Used |
| Stock Number | BM1900 |