Rudolph NSX 105

Macro-Defect

Metrology Equipment

Currently Configured for: 300mm

Current Equipment Status: Available

Asset HDD not included

Available date: Currently Available

PROBE TCP-3ONTO_NSX105_MACRINSP_01 Onto innovation NSX105 Inspection

AUDIT TO VERIFY

AUGUST INSPECTION SYSTEM

• Rudolpht NSX-105
• Loading Configuration : Open Cassette & FOUP
• Type: Macro Inspection
• Wafer Size: 100mm to 300mm

System Feature:

• Throughput: Up to 120 Wafers per hour
• Performance: Up to 60MB processing / Sec
• Review Camera: Adimec 33 FPS 3CCD Color
• Illumination: High Speed Strobe
• Staging: Using Continuous Scan Technology
• Inspection Axis: Linear motor drive
• Support Wafer: 100mm to 300mm (<300 on film frames)
• Defect Sensitivity: To 0.5micron (User Adjustable)
• Dark Field Option: Yes
• OS: Windows XP
• Computer: 2.4Ghz
• Image Processing System: Genesis (2 nodes)
• Data Collection: Automatic
• Platform: Aluminum hard anodized with Ni Plating
• Turret Assembly: 1X , 2X, 5X, 10X and 20X
• 2D Defect and Metrology Verification Standard: NIST Certified
• Mini Environment for Wafer Handling: Class 100 with 600CFM
• Filter Blower Ionizer for Clear Air: Included
• Light Tower: Included
• Docking Module: Included
• Multipass Software: Included
• Single OCR: Whole Wafer Only
• Wafer Map Integration and Test Service: Included
• DCS I: Defect Capture Station Stand alone Capturing Images from Inspection system
• Review Pilot Software: Included
• High Speed Focus Map Sensor (Point Sensor): Resolution 0.02um measuring range +-1/0 working distance 10mm spot dimeter 20um, response time 200ms Linearity +-0.03% of F.S. Visible Red 650nm Laser Light Source

Facility: Configuration:

• Single Phase + GRD
• Power: 200-240 VAC @ 50/60 Hz
• Full Load: 40 Amps
• Largest load: 8Amp
• House Vacuum CDA
• Weight: 2000 lbs