1998 Disco DFG841 Wafer Grinding, Lapping & Polishing

The machine is crated now in the warehouse.

6"

Working Condition

Wafer : 8 Inches.

Vintage : 1998.

It’s complete with HDD and Software included.

Machine Configuration (DFG841)

 Model: Disco DFG841

 Spindle Speed (Max): 7,000 rpm

 Power: AC 200V, 50/60 Hz, 3-Phase, 17 kVA

 Air Requirement: 0.5 MPa (5 kgf/cm²), 300 L/min (ANR)

 Cutting Water: 0.2 MPa (2 kgf/cm²), 15 L/min

 Cooling Water: 0.2 MPa (2 kgf/cm²), 11 L/min

 Weight: ~2,300 kg

 Manufacture Date (your unit): Feb 1998 (with external transformer dated Nov 1997)

Wafer Size & Capability

 Supported Wafer Sizes: 8-inch (200 mm) wafers.

 Grinding Method: In-feed grinding with wafer rotation.

 Accuracy: Planarity ≤ 1.5 µm across wafer.

Standard Included Units 

1. Main Grinder Unit (DFG841 body with dual spindle).

2. Vacuum Coolant Unit (VCU) – provides cooling and chip removal (separate floor-standing unit).

3. Chiller Unit – stabilizes grinding fluid temperature.

4. Filter Unit – for grinding water/coolant circulation.

5. Robot Unit – automated wafer handling between cassettes and chuck tables.

6. Transformer (20 kVA, Tokyo Sanyu Denki) – converts facility power (208–415 V input → 200 V

output).

7. Electrical Compartment – control and power distribution.

Basic Standard Configuration

 Two chuck tables (porous vacuum type).

 Automatic cassette loading/unloading with same-cassette return.

 Wafer thickness measurement (contact gauge system).

 Spindle options: Configurable for coarse + fine grind.

 Compliance: DFG841 specifically conforms to CE Mark & SEMI S2-93 standards.