2001 STS MESC Multiplex ICP ASE

STS ASE Multiplex ICP System (Bosch Process)

OEM = Surface Technology Systems Limited (AKA: STS)

Model = MESC Multiplex ICP ASE

Type = ICP RIE (Inductively Coupled Plasma, Reactive Ion Etch)

Description of Process = ASE (Advanced Silicon Etch, Bosch Process)

Wafer Size = 150mm

Loader capacity = 2 wafer Carousel

Chuck Type = Mechanical Weighted Clamp

Process Gases:

C4F8 = 300 Sccms

SFG = 600 Sccms

O2 = 100 Sccms

AR = 100 Sccms

Turbo Pump = Leybold Mag 2000 CT

RF Generator 1 = ENI ACG-3

RF Generator 2 = AE RFG 3001 (Advanced Energy)

Vacuum measurement = MKS Instruments

Gate Valve = VAT Throttling Gate Valve

Slit Valve = Vat Slit Valve

Manuals = STS MESC Multiplex ICP Operator’s and Modular Parts Catalogue

Vacuum Pump Loadlock = Edwards Pump E2M40

Vacuum Pump Process Module = Edwards IQDP80 w/IQDB250 Blower (intelligent Interface)

Chiller = Affinity, PWG-060K-BE33CBC2