Royce Instruments DE35i-6 pick and place for wafers up to 150mm

Royce DE35i-6 semiautomatic pick and place

configured with clamping device for wafers up to 150mm 

vacuum pickup of die from film mounted wafers and places into waffle packs

minimum die size 0.008" square

Optem zoom microscope with coaxial fiber illuminator and power supply

monitor and crosshair generator