2004 Semitool Sirius System

- Model: Sirius HydrOzone

- Wafer Size: 150mm & 200mm wafer capable

- Process: DI water/ozone

- Rinse: DI water with ammonium hydroxide

- Dry: N2

- Spray processing chamber.

- Uses a minimal amount of deionized water and ozone

- Low cost, low environmental impact process used for photoresist stripping, photolithography rework and organic cleans

- Does not require the use of sulfuric acid with its related delivery and disposal costs

- Year of Manufacture: 2004