2005 DNS SS3000

300mm

EQUIPMENT DETAILS:

Tool is operating in clean room.

Labelled as Collateral Asset.

[Chamber A]

Process : Wafer surface clean

Chuck : Vacuum Chuck

SPRAY : Soft Spray N2 10~100NL/min

Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ

Spin DRY : 3000rpm Spin Dry only

[Chamber B]

Process : Wafer surface clean

Chuck : Vacuum Chuck

SPRAY : Soft Spray N2 10~100NL/min

Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ

Spin DRY : 3000rpm Spin Dry only

[Chamber C]

Process : Wafer Backside clean

Chuck : Mechanical Chuck

SPRAY : Soft Spray N2 10~200NL/min

Burush : PVA Burush

Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ

Spin DRY : 2400rpm Spin Dry only

[Chamber D]

Process : Wafer Backside clean

Chuck : Mechanical Chuck

SPRAY : Soft Spray N2 10~200NL/min

Burush : PVA Burush

Rinse :DIW/ CO2 INJENCTION ,resistivity <1MΩ

Spin DRY : 2400rpm Spin Dry only

Missing or damaged parts: Not reported.