2004 Semitool SST-C-642-250

Batch Wafer Processing

Etch/Clean - Wet Processing

Currently Configured for: 200mm

6 tanks, 4 of them heated,

2 chambers.

Tool Configuration

• Model: Semitool SST-C-642-250 Solvent Spray System
• Chamber Type: Dual-stack, 8-pump configuration
• Process Type: Solvent resist strip / lift-off / clean
• Wafer Size: Configured for 200 mm (150 mm carriers optional)
• Tank & Pump Configuration:
• Tank 1 – Pump 1: ACT 412 (not used)
• Tank 2 – Pump 2: N-Methyl-2-pyrrolidone (NMP)
• Tank 3 – Pump 3: ACT 412 (not used)
• Tank 4 – Pump 4: N-Methyl-2-pyrrolidone (NMP)
• Tank 5 – Pumps 5 & 7: Acetone
• Tank 6 – Pumps 6 & 8: Isopropyl Alcohol (IPA)
• Typical Process Sequence: Hot NMP strip → Acetone rinse → IPA final rinse/dry
• Construction: Stainless-steel solvent tanks, explosion-proof enclosures, nitrogen purge
• Facilities: CDA, N₂, exhaust, drain, 208 V 3-phase power
• Notes: Two ACT 412 tanks currently idle; may be re-purposed for additional solvents or rinses. No acid tanks installed.