TEL WDF Frame Prober
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Description
Tel WDF 8DP Frame Prober
Fully Automatic Frame Prober (Wafers & Frames) // with special light shielding // SPECIFICATION OF
WAFER: Size 5", 6", 8" / Thickness: 150-2000um / Die size: 350-75000um / Weight: 110g max //
SPECIFICATION OF DICING FRAME: Size: 8" / Thickness: 350-1500um / Die size: 350-75000um /
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Specifications
| Manufacturer | TEL |
| Model | WDF Frame Prober |
| Condition | Used |
| Stock Number | GOD23082019720222732 |