LAM 2300 Flex FXP

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Available quantity: 2

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Description

  • Wafer Size: 300
  • Category: Semiconductor Fabrication
  • Family: Etch Equipment
  • Type: PolySilicon Etch System
  • Group: Electronic
  • 2 available


Specifications

ManufacturerLAM
Model2300 Flex FXP
ConditionUsed
Stock NumberBM3196