LAM 2300 Flex FXP
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Description
- Wafer Size: 300
- Category: Semiconductor Fabrication
- Family: Etch Equipment
- Type: PolySilicon Etch System
- Group: Electronic
- 2 available
Specifications
| Manufacturer | LAM |
| Model | 2300 Flex FXP |
| Condition | Used |
| Stock Number | BM3196 |