Disco DFD6361
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Description
- Wafer Size: 300
- Group: Electronic
- Category: Semiconductor Assembly & Packaging
- Family: Dicing Saws/Scribes
- Type: Dicing Saw
- Manufacturer: Disco
Specifications
| Manufacturer | Disco |
| Model | DFD6361 |
| Condition | Used |
| Stock Number | BM3211 |