Tresky T-3002-FC3 FLIP CHIP DIE BONDER WITH 200MM WAFER STAGE AND EUTECTIC

Tresky T-3002-FC3 FLIP CHIP DIE BONDER WITH 200MM WAFER STAGE AND EUTECTIC

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Description

CONFIGURED WITH:


100MM SQUARE EUTECTIC HEATED WORK HOLDER


EPOXY STAMPING


FLIP CHIP BEAM SPLITTER OPTICS


2" AND 4" WAFFLE PACK PICKUP


PICKUP FROM WAFER UP TO 200mm

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Specifications

ManufacturerTresky
ModelT-3002-FC3 FLIP CHIP DIE BONDER WITH 200MM WAFER STAGE AND EUTECTIC
ConditionUsed
Stock NumberBM3322